AGS
Plasma Systems, Inc. 
MPS - 200 - PECVD
Batch
Deposition
A versatile multi-process PECVD tool with flexible controls and excellent uniformity - all for low price.
MPS-PECVD Features
If you need reliability time after time when depositing low temperature films, the MPS Plasma Enhanced Chemical Vapor Deposition tool offers you the best value. Excellent process control and trouble-free operation can be yours.
- High performance PECVD at a low cost
- SiO2, SiNx, Amorphous Si, Oxynitride and carbon films
- Low temperature passivation and ILD films for III-V and HTSC compunds
- Configure as PECVD or ECR deposition tool
- Safety interlocks meet stringent requirements
- Low hydrogen containing films assured by using residual stripping cryo pump
- NEW! mixed frequency and pulsed RF options for stress control
- Closed loop (PID) control of deposition temperature
- Unique "Direct-Connect" construction is easy to service or upgrade
MPS-CVD Delivery
Delivery: 90 days ARO
Warranty: 1 year parts & labor
Installation: Start up & training are included with the system
Service: 1 year of quarterly PM's can be included with each system
Extraordinary capability -
Excellent value
"A whole new plasma system"
For more information:
Please send your questions, comments, or suggestions to the AGS Sales desk
Copyright 1991-2008 AGS Plasma - All Rights Reserved
MPS, System 1700, APC-2000, & PlasmOps are trademarks of AGS Plasma.
Other trademarks are the property of their respective owners.
Prices and specifications subject to change without notice.
Last update made on: 6 September, 2008 by Webmaster