AGS
Plasma Systems, Inc.

Frequently Asked Questions
To help our Semi-Group/IPE/PME/1700 users, we provide quick
service notes to give you important information about how to
maximize uptime on your system.
For answers to some common questions, click here to jump to
that topic:
Frequently Asked Questions Index
- Q: Main power is on but the RF power supply doesn't work.
What should I check?
A: Check the door interlocks and look for a circuit
breaker on the back on the RF power supply unit.Q: I
just installed a new mechanical pump but the system won't
pump down. What can cause this
A: Check for correct rotation on pump. 3 phase pumps are
phase sensitive. You may need to reverse two of the phase
wires then check at pump inlet for actual vacuum. Also,
you may have a leak at one of the KF fittings
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- Q: How do I abort a PC5000 process?
A: Press the "Stop" button and wait until the
alarm rings at least 5 times. The process will advance to
step 9 which completes the run and activates the super-purge
routine.
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- Q: My system seems to take longer and longer to pump down.
What's wrong?
A: The system probably just needs to be wet cleaned. But,
it may need a thorough preventive maintenance service.
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- Q: My gas flow is very unstable. What can be the cause of
this?
A: Usually, this is a problem with either the MFC or your
regulators. See also: MFC trouble
guide
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- Q: I have no plasma. My RF power supply shows high
reflected power. What is wrong?
A: It could be many things. See if you get improvement by
manually tuning the matching network. Check to see if you
can run the standard test plasma. Finally, Check your RF
cable connections.
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- Q: I hear a "clunking" noise when I raise the
chamber and it won't go all the way up. What is it?
A: Sounds like you hoist chain may be slipping. Try to
increase the chain tension. We also have a chain idler
retrofit available for older Semi-Group/IPE systems.
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- Q: I did a wet clean and now my etch rate is down (or up)
from normal. How do I fix this?
A: This is common. It is most likely due to the chamber
walls being so clean that "normal" process
residues have not recoated the chamber. This affects the
chemistry and impedance of the process chamber and can
affect etch rates. Try to run a load of test samples
using your standard process. After a period of time, your
process should stabilize.
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Have a question or your own idea for a FAQ?
Let us know at the AGS Plasma Support desk
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System 1700, 1700 Research Locus, APC-1000, & PlasmOps are trademarks of AGS Plasma.
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Last update made on: 6 September, 2002 by Webmaster